梁鑫 教授


梁鑫

教授/博导

  办公室:化新楼104A

  E-mailliangxin-mse@buct.edu.cn


  研究领域:
  探索物质的微观结构、物理输运性质及力学行为,主要研究无机材料体系,如半导体、陶瓷和金属及其复合材料,包括晶体和非晶态物质。



2008–2013年,美国哈佛大学,应用物理,硕士、博士

导师:David R. Clarke院士

2006–2008年,加拿大麦克马斯特大学,材料工程,硕士

导师:J. David Embury院士和Hatem S. Zurob教授

2002–2006年,北京科技大学,材料物理,学士



2023至今,北京化工大学,材料科学与工程学院,教授、博士生导师

2019–2023年,中国科学院大学,北京纳米能源所/纳米科学与工程学院,研究员、博士生导师

2014–2019年,常州大学,材料科学与工程学院,教授、研究生导师

2013–2014年,美国布朗大学,工学院,博士后

合作导师:Brian W. Sheldon教授;

2013年,美国哈佛大学,工程与应用科学学院,博士后

合作导师:David R. Clarke院士

科研成果:

近年来在超晶格结构与物理输运性质、微观界面能量传递、晶格动力学、电子热输运、非晶态物理输运性质等基础科学研究方向上取得了研究成果,同时开展了热电能量转换材料及微电子热管理复合材料的应用科学研究;设计搭建低维材料物理性质观测系统。迄今,研究成果发表在Acta Mater. (9)Appl. Phys. Lett. (8)Phys. Rev. BJ. Phys. Chem. Lett.等国际SCI学术期刊上(第一/通讯作者论文34篇),应邀撰写Elsevier出版英文科技专著1章。主持完成国家自然科学基金及省级等多个课题项目,承担央企合作研究课题,曾入选“江苏省特聘教授”等省部级人才计划。长期担任Acta MaterialiaAdvanced MaterialsAdvanced Functional MaterialsNano LettersApplied Physics LettersMaterials TodayACS Applied Materials & InterfacesSmall等国际SCI学术期刊审稿专家

招生:

每年拟招收博士生1名,硕士生3~4名;欢迎具有物理学、材料学、电子科学与技术及无机化学等相关背景的同学报考;拟招收具有相关专业背景的博士后1名。 

 

代表论文

1.      X. Liang* and S. Yang, Thermal transport properties of ultra-high-temperature ceramic superlattices, Applied Physics Letters, 2025, publishing online, (Chosen as a Featured article by the Editors).

2.      S. Yang, H. Bu, Y. Shao, X. Liang*, Energy transport mechanisms and characteristic vibration energy regimes for thermal conduction in bulk metallic glass, Applied Physics Letters 2024, 124, 053901.

3.      X. Liang* and C. Wang, Anomalous behavior of strain modulated lattice thermal transport in piezoelectric crystals and the effect of polarization, Acta Materialia 2022, 241, 118406.

4.      X. Liang* and C. Wang, Insights into strain dependent lattice thermal conductivity of tin oxide, Acta Materialia, 2022, 239, 118289.

5.      X. Liang* and C. Chen, Ductile inorganic amorphous compounds with phonon-glass electron-crystal transport behavior and excellent stability of high thermoelectric performance on plastic deformation, Acta Materialia, 2021, 218, 117231.

6.      X. Liang*, H. Wang, and C. Wang, Lattice thermal conductivity of transition metal carbides: evidence of a strong electron-phonon interaction above room temperature, Acta Materialia, 2021, 216, 117160.

7.      X. Liang*, and F. Dai, Epoxy nanocomposites with reduced graphene oxide constructed 3D networks of single wall carbon nanotube for enhanced thermal management capability with low filler loading, ACS Applied Materials & Interfaces, 2020, 12(2), 3051-3058.

8.      X. Liang*, C. Chen, and F. Dai, Effect of plastic deformation on phonon thermal conductivity of α-Ag2S, Applied Physics Letters, 2020. 117(25): p. 253901. (Editor’s Pick)

9.      X. Liang*, C. Wang, and D. Jin, Influence of nonstoichiometry point defects on electronic thermal conductivity, Applied Physics Letters, 2020. 117(21): p. 213901.

10.   X. Liang* and C. Wang, Electron and phonon transport anisotropy of ZnO at and above room temperature, Applied Physics Letters, 2020, 116(4), 043903. (Chosen as a Featured article by the Editors, highlighted in AIP Scilight)

11.   X. Liang*, L. Shen, and C. Wang, Origin of anisotropy and compositional dependence of phonon and electron transport in ZnO based natural superlattices and role of atomic layer interfaces, Nano Energy, 2019, 59, 651-666.

12.   X. Liang* and F. Dai, Reduction of the Lorenz number in copper at room temperature due to strong inelastic electron scattering brought about by high-density dislocations, The Journal of Physical Chemistry Letters, 2019, 10, 507-512.

13.   X. Liang* and L. Shen, Interfacial thermal and electrical transport properties of pristine and nanometer-scale ZnS modified grain boundary in ZnO polycrystals, Acta Materialia, 2018, 148, 100-109.

14.   X. Liang*, Mobile copper ions as heat carriers in polymorphous copper sulfide superionic conductors, Applied Physics Letters, 2017, 111, 133902.

15.   X. Liang*, Impact of grain boundary characteristics on lattice thermal conductivity: A kinetic theory study on ZnO, Physical Review B, 2017, 95, 155313.